Laird Technologies - Tpreg™ HTD Circuit Boards Materials
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Tpreg™ HTD Circuit Boards Materials

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Tpreg™ HTD is a thermally conductive dielectric adhesive pre-preg material.

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Tpreg™ HTD is used in conjunction with copper foil and an integral metal plate to provide a circuit board laminate that has superior thermal management capabilities and a 150°C continuous use temperature.



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Item #

Max. Continuous Operating Voltage

Thermal Conductivity

Thermal Resistance

Dielectric Thickness

Peel Strength

HTD04 240 VAC
450 VDC
2.20 W/m-K 0.072 ºC-in2/W
0.464 ºC-cm2/W
0.004 inches
0.102 mm
6.5 lb/in
1.16 kg/cm
HTD06 480 VAC
950 VDC
2.20 W/m-K 0.107 ºC-in2/W
0.690 ºC-cm2/W
0.006 inches
0.152 mm
7.0 lb/in
1.25 kg/cm
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