Laird Technologies - Tflex™ SF600 DF Series Gap Filler Material
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Tflex™ SF600 DF Series Gap Filler Material

 
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TFlex SF600

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Compliant Silicone-Free 2.8-3.0 W/mK Thermally Conductive Gap Filler

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Tflex™ SF600 DF is a high performance, silicone-free thermal gap filler with a conductivity of 2.8 - 3.0 W/mK. Tflex™ SF600 DF is designed for applications which are silicone sensitive. This material is certified to UL 94V0 flammability rating.



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Item #

Color

Thickness

Thermal Conductivity

Density

Hardness

Tflex SF620 DF Rose 0.020 inches
0.508 mm 		2.8 W/m-K 1.27 g/cc 83(at 3 second delay) Shore OO
Tflex SF623 DF Rose 0.023 inches
0.584 mm 		2.8 W/m-K 1.27 g/cc 83(at 3 second delay) Shore OO
Tflex SF630 DF Rose 0.030 inches
0.762 mm 		2.8 W/m-K 1.27 g/cc 83(at 3 second delay) Shore OO
Tflex SF640 DF Rose 0.040 inches
1.02 mm 		3.0 W/m-K 1.27 g/cc 80(at 3 second delay) Shore OO
Tflex SF650 DF Rose 0.050 inches
1.27 mm 		3.0 W/m-K 1.27 g/cc 80(at 3 second delay) Shore OO
Tflex SF660 DF Rose 0.060 inches
1.52 mm 		3.0 W/m-K 1.27 g/cc 80(at 3 second delay) Shore OO
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