Laird Technologies - Metallized Conductive Fabric
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Metallized Conductive Fabric

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Flectron metallized fabric combines highly conductive metals with lightweight fabric to meet a diverse range of EMI/RFI shielding requirements. Manufactured with Laird Technologies’ patented technology, Flectron metallized fabric is available in various woven and non-woven substrate configurations.

Whether used as an architectural shielding product to shield complete rooms, or as the shielding material in EMI gaskets, tapes, and shield laminates, Flectron fabrics provide a highly effective shielding system that is cost-effective and easily applied.

Laird Technologies uses a patented technology for applying thin metal coatings of copper or nickel to woven and nonwoven fabrics. As a result, Flectron metallized materials have the flexibility, conformability and breathability of a fabric with the electrical properties of a metal. This means low surface and through resistivity and excellent shielding effectiveness.




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Item #

Item Name

Material

Nominal Thickness

Surface Resistivity (ASTM F390)

3027-217 Metallized Conductive Fabric Ni/Cu Polyester Nonwoven 0.016 inches ≤ 0.07 Ω/sq.
3027-235 Metallized Conductive Fabric Ni/Cu Polyester Nonwoven UL94 VTM-0 0.016 inches ≤ 0.07 Ω/sq.
3035-535 Metallized Conductive Fabric Ni/Cu Polyester Taffeta 0.005 inches ≤ 0.07 Ω/sq.
3035-216 Metallized Conductive Fabric Ni/Cu Polyester Taffeta V0 0.008 inches ≤ 0.07 Ω/sq.
3070-500 Metallized Conductive Fabric Ni/Cu Polyester Mesh 0.007 inches ≤ 0.1 Ω/sq.
3050-525 Metallized Conductive Fabric Ni/Cu Nylon Ripstop 0.005 inches ≤ 0.07 Ω/sq.
3050-517 Metallized Conductive Fabric Ni/Cu Nylon Ripstop UL94 V0 0.008 inches ≤ 0.07 Ω/sq.
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