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Tpli 200 Series™ is the premium gap filler. An unique blend of boron nitride and silicone produce Laird Technologies' highest performing interface pad.
Tpli 200's exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. Tpli 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. Tpli is electrically insulating, stable from -45ºC to 200ºC, and meets UL 94HB rating.