Search Catalog  
All Categories > Thermal Management Solutions > Thermoelectric Modules > eTECTM Series - Thin Film Thermoelectric Module > Item # HV37,48,F2,0202,GG  

Item # HV37,48,F2,0202,GG, eTECTM Series - Thin Film Thermoelectric Module


    border="0" Printable Page  
    Email Email This Page  
    Save To Favorites Save To Favorites
  

The eTECTM Series HV37 can produce 3.7 Watts of cooling capacity at 25°C ambient in a 6.9 mm2 footprint. Assembled with thin film semiconductor material and thermally conductive Aluminum Nitride ceramics, the eTECTM Series is designed for lower current applications with alternate geometries, cooling capacities, input power ranges, and tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies.

Features

  • Micro Footprint
  • High Heat Pumping Density
  • Precise Temperature Control
  • Reliable Solid State Operation
  • <2 ms Response Time
  • RoHS Compliant

Applications

  • Laser Diodes
  • Photodiodes
  • Infrared (IR) Sensors
  • Pump Lasers
  • Crystal Oscillators
  • Optical Transceivers

Package Assembly Conditions
Max Time Exposure > 290°C for 60 sec
Peak Assembly Temperature: 325°C

Temperature Conditions
Max Operating Temperature: 150°C

Isometric Drawing




 Specifications   

ΔTmax
(TH = 85ºC)

45 °C

Qmax

3.7 watts

Imax

1 A

Vmax
(TH = 85ºC)

6.4 V

Qmax / area

66 W/cm²

Electrical Resistance

5.5 ohms

Thermal Resistance

15.5 ºK/W

Dimension A

2.36 mm

Dimension B

2.36 mm

Dimension C

2.38 mm

Dimension D

3.77 mm

Dimension E

0.62 mm


 DOWNLOADS 

Datasheet
(, 0KB)

Isometric Drawings
(PDF, 11KB)