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Item # HV14,18,F0,0102,GG, eTECTM Series - Thin Film Thermoelectric Module

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The eTECTM Series, HV14 can produce 1.4 Watts of cooling capacity at 25°C ambient in a 1 mm2 footprint. Assembled with thin film semiconductor material and thermally conductive Aluminum Nitride ceramics, the eTECTM Series are designed for lower current applications with tight geometric space constraints. Custom alternate geometries, cooling capacities, input power ranges, designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies.


  • Micro Footprint
  • High Heat Pumping Density
  • Precise Temperature Control
  • Reliable Solid State Operation
  • <2 ms Response Time
  • RoHS Compliant


  • Laser Diodes
  • Photodiodes
  • Infrared (IR) Sensors
  • Pump Lasers
  • Crystal Oscillators
  • Optical Transceivers

Package Assembly Conditions
Max Time Exposure > 290°C for 60 sec
Peak Assembly Temperature: 325°C

Temperature Conditions
Max Operating Temperature: 150°C

Isometric Drawings


(TH = 85ºC)

45 °C


1.3 watts


0.9 A

(TH = 85ºC)

2.5 V

Qmax / area

64 W/cm²

Electrical Resistance

2.3 ohms

Thermal Resistance

46 ºK/W

Dimension A

1.15 mm

Dimension B

2.04 mm

Dimension C

1.89 mm

Dimension D

0.6 mm

Dimension E

0.62 mm


(, 0KB)

Isometric Drawings
(PDF, 11KB)