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Item # Tflex HR200, Tflex HR200 Series Thermal Gap Filler

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MID-PERFORMANCE GAP FILLER WITH 1.6 W/MK

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Tflex™ HR200 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.

The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock, resulting in improved device reliability.

Tflex™ HR200 is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and component transport.

Tflex™ HR200 is stable from -50ºC thru 160ºC.




 Specifications   Features and Benefits   Application   Options   

Construction and Composition

Naturally tacky Ceramic filled silicone elastomer

Color

Grey

Thermal Conductivity

1.6 W/m-K

Hardness (Shore 00)

50

Specific Gravity

2.4 g/cc

Available Thickness Range

0.020 - 0.320 inches

Temperature Range

-50 to 160 ºC

Outgassing TML

0.35 %

Outgassing CVCM

0.06 %

Coefficient of Thermal Expansion

296.54 ppm/ºC


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