(5) T-preg™ 1KA is a thermally conductive electrically insulating pre-preg.
The T-lam thermally conductive printed circuit boards use T-preg™ 1KA dielectric sheets in conjunction with copper foil and an integral metal base plate to provide a circuit board laminate that has superior thermal management capabilities compared to conventional FR4-based printed circuit boards (PCBs).
(2) T-preg™ HTD is a thermally conductive dielectric adhesive pre-preg material.
T-preg™ HTD is used in conjunction with copper foil and an integral metal plate to provide a circuit board laminate that has superior thermal management capabilities and a 150°C continuous use temperature.
T-lam™ thermally conductive printed circuit boards use T-preg™ dielectric sheets in conjunction with copper foil and an integral metal base to provide circuit board laminate that has superior thermal management capabilities when compared to conventional FR4-based printed circuit boards (PCBs).
T-preg™, a free standing thermally conductive dielectric sheet, Facilities single layer, multilayer and FR4-hybrid construction.
T-preg™ is the only high thermal conductivity free-standing pre-preg available.
Our engineers routinely work with OEMs and fabricators to design circuit boards using the T-lam™ system.
