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Specialty Products EMI Shielding Solutions

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ElectroCoat - Product Image

ElectroCoat Specialty Products

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ElectroCoat is a thin, flexible surface coating consisting of a silver-filled silicone elastomer. The versatile coating can be easily applied to die-cut or molded foams for both gasket and non-gasket applications. It can also be applied to molded or extruded elastomers, other polymers, and a wide range of other materials.

ElectroPrint - Product Image

ElectroPrint Conductive Printed Gaskets

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Laird Technologies offers the technique of printing conductive elastomers as a very cost-effective method of producing gaskets. The printed process produces a highly selective deposit resulting in negligible waste.

ElectroCaulk - Product Image

ElectroCaulk EMI Caulking Compound

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ElectroCaulks are single component electrically conductive sealants for shielding of structures, cabinets, and conduits against electromagnetic interference (EMI). ElectroCaulks are based on silver-plated copper, silver-plated aluminum, silver-plated glass, and nickel-coated graphite filled silicone, or silver-coated aluminum and nickel-coated graphite filled polyisobutylene. ElectroCaulks are based on stable fillers and can be used within the recommended temperature range (see material specification) without any degradation in electrical or physical properties.

Product Image - Board To Chasis Conductive StandOff

Board to Chassis Conductive Stand-Off

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Laird Technologies offers a multi-functional grounding device that provides electrical contact between the bottom of printed circuit boards and enclosure housings. The snap in feature allows for easy assembly and secure retention. Once inserted, the part makes contact with the base of the printed circuit board on a grounding pad or trace, assuring superior grounding.

Product Image - Electrically Conductive Elastomer Backplane Shielding

Electrically Conductive Elastomer Backplane Shielding Component

Laird Technologies introduces a new line of backplane shielding: a low compression force frame gasket. The low compression force is achieved by combining an electrically conductive elastomer layer over a low density foam insert. The gaskets are supplied with pressure sensitive adhesive (PSA) to facilitate quick and easy mounting. These picture frame gaskets are mounted around the connectors of a backplane. The printed circuit board housing is then inserted into these connectors, thereby engaging the gaskets. To order, specify length, width, height, profile cross-section size, and material compound.

ElectroBond - Product Image

ElectroBond Electrically Conductive Adhesive Component

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ElectroBond electrically conductive adhesives are single component RTV (room temperature vulcanizing) adhesive systems designed for bonding conductive elastomer gaskets to metal flanges, or for providing EMI and environmental protection as a sealant. These materials form a cured skin within 30 minutes after exposure to atmospheric moisture without forming any corrosive byproducts. However, a full cure at room temperature is obtained after one week at 45% minimum relative humidity. Since the cure is caused by atmospheric moisture, ElectroBond is recommended in applications where the bond thickness is under 0.020 (0,5). ElectroBond is a solvent-free adhesive/sealant and cures with little or no shrinkage. Bonds remain flexible and ...

ElectroEpoxy- Product Image

ElectroPoxy Electrically Conductive Adhesive Component

ElectroPoxy (4 x A1) electrically conductive adhesive is a dual-component system designed for bonding metal gaskets to flanges and maintaining their overall shielding effectiveness. It can also be used to repair printed circuit boards, restore the continuity of electrical circuits, attach electrical wires to delicate components and bond conductive textiles to metal.ElectroPoxy components are supplied in two 1-ounce (30 cc) jars. The contents of each are mixed in a 1:1 ratio to obtain a thick paste that can be applied where necessary. Curing may take place at room temperature or up to 212°F (100°C) to produce a very strong and highly conductive bond.