Laird Technologies extensive product line solves hundreds of EMC problems. But each customer problem is unique. One of our standard products may not precisely meet your needs. Often a modest modification in one of our existing products will solve your problem quickly, effectively and economically.
Laird Technologies experts combine half a century of EMC experience with state-of-the-art CAD capabilities to help you determine the optimum design for your application. Chances are we have solutions to problems you may not yet have encountered.
Our CAD helps you fine-tune your initial designs. Our finite element analysis (FEA) simulates the performance of that design under actual working conditions. Our CNC equipment helps produce precisely fabricated samples. Our optical gauging inspection system ensures that the latest measurement technology is used to measure your parts. Computer-programmable high-speed Bruderer punch presses enable our progressive dies to produce families of parts economically by eliminating the need for costly multiple dies. The result: Laird Technologies can meet your custom stamping needs with the shortest, most reliable lead times in the industry.
Some of the nation’s leading manufacturers of high technology products turn to Laird Technologies for their custom assembly requirements. Critical lead time and inspection criteria are ensured by SPC quality control during both stamping and assembly operations.
MultiSlide fabrication provides high volume production quantities with low-cost tooling. A variety of part configurations can be designed for this economic process. In-house tooling design and manufacturing help reduce lead times.
Laird Technologies has added Drawn Cans to its extensive list of board level shielding solutions. As microprocessor speeds continue to increase, so does the potential for EMI leakage through the smallest apertures in board level shields (BLS). Laird Technologies’ Drawn Cans are designed to provide additional near field and far field circuit isolation (attenuation) at higher frequencies by eliminating the apertures found in the corners of traditional BLS solutions. Drawn cans utilize small ground trace sizes, thereby preserving packaging space on the PC board.
