Tpli 200 Series™ is the premium gap filler. An unique blend of boron nitride and silicone produce Laird Technologies' highest performing interface pad.
Tpli 200's exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. Tpli 200 absorbs shock and relieves stresses, thus minimizing potential ...
The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™ 200 V0 combines good thermal conductivity of 1.1 W/m-K with high compressibility to produce low thermal resistance. The alumina filler allows Tflex™ 200 V0 to remain a cost effective solution where moderate thermal performance is acceptable. Tflex™ 200 V0 is naturally tacky and does not need an ...
Tflex™ HR200 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and ...
Ultra Compliant, Thermal Gap Filler for High-Speed Computing and Telecommunications Applications
Tflex™ 300 is a silicone gel combined with a ceramic powder to offer an unique combination of compliancy, thermal resistance and price.
Tflex™ 300, at pressures of 50 psi, deflect over 50% the original thickness. This high rate of compliancy allows the material to "totally blanket" the component, enhancing thermal ...
Unique silocone gel offers compliancy, thermal resistance
The high rate of compliancy of Tflex™ 300TG allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 ...
Tflex™ HR400 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and ...
Compliant 2.0 W/mK Thermally Conductive Gap Filler
Tflex™ XS400 is a compliant elastomer gap filler designed to provide moderate thermal performance. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on mating parts.
Tflex™ XS400 is naturally tacky, no adhesive coating is required. Due to its TG liner on the other side, Tflex™ XS400 is electrically insulating, ...
Highly Compressible Thermal Gap Filler with 2.8 W/m-K
Tflex™ 500 is a highly compressible gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on mating parts.
Tflex 500’s unique silicone formulation has extremely low silicone extractables compared to other silicone interface ...
Tflex 600 Series™ is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3.0 W/m-K. These outstanding properties are the result of a proprietary boron nitride filler in the composition.
The high conductivity, in combination with extreme softness, produces incredibly low thermal resistances. While extremely soft, Tflex 600 recovers to over 90% of its original thickness after ...
Tflex™ HR600 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and ...
Compliant Silicone-Free W/mK Thermally Conductive Gap Filler
Tflex™ SF600 is a high performance, silicone-free thermal gap filler with a conductivity of 3.0
W/mK. Tflex™ SF600 is designed for applications which are silicone sensitive. This material is
RoHS compliant.
Compliant Silicone-Free 2.8-3.0 W/mK Thermally Conductive Gap Filler
Tflex™ SF600 DF is a high performance, silicone-free thermal gap filler with a conductivity of 2.8 - 3.0 W/mK. Tflex™ SF600 DF is designed for applications which are silicone sensitive. This material is certified to UL 94V0 flammability rating.
Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts.
Tflex™ 700’s unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance.
Tputty™ 502 Series is the best material for applications where large tolerance differences create the need for compression of interface material beyond 50% of its original thickness.
Tputty™ 502 flows to ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, Tputty™ 502 has a high thermal conductivity that results in very low thermal ...
Tputty™ 504 is a soft silicone gel thermal gap filler ideal for applications where large gap tolerances are present.
The silicone gel is filled with a complex matrix of ceramic fillers to yield superior thermal performance.
Tputty™ 504 is soft and compliant transferring little to no pressure between interfaces. Because Tputty™ 504 has a higher viscosity than grease, it eliminates the bleed, separation and ...
Tputty™ 506 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is ideal for applications where large gap tolerances are present and in which traditional gap filler pads may apply added pressure on components. This material can be dispensed to fill large and uneven gaps in assemblies.
Tputty™ 506 has a composition which yields superior thermal ...
